The AutoSmart M is a micro IRt/c sensor connected to our AutoSmart transmitter for analog output. The micro IRt/c sensor is the smallest available in its class. This makes it an ideal candidate for use in confined spaces. As a result of its small size, it is capable of measuring small spots (3mm diameter). Used in various applications, including medical equipment, printing applications and robotics. Air purge jackets and mounting brackets are available as accessories.
The AutoSmart M features:
- Output 0-5V, 0-10V, 4-20mA (scalable)
- Non-contact
- Repeatability error 0,1% full scale
- Interchangeability ±1,5% full scale
- Resolution approx. 0,1°C (0.2°F)
- Small size sensor
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CleverIR AutoSmart IRt/c’s
AutoSmart 3X
The AutoSmart 3X is the IRt/c.3X connected to the AutoSmart transmitter for analog output. The IRt/c.3X is one of our most popular sensors. It has a specialized detector with high sensitivity, operating across a broad temperature range up to 250°C. Target measurement is possible as low as-30°C, in environments as cold as -50°C. With its built-in airpurge it can be used in harsh environments and has a proven track record in challenging applications. Examples are: heavy industry, oil and gas, mining, transport, drying and curing.
AutoSmart 3SV
The AutoSmart 3SV is an IRt/c.3SV sensor connected to the AutoSmart transmitter for analog output. The IRt/c.3SV is the Side View model of the IRt/c.3X, one of our most popular models. Designed with built-in airpurge, making it very robust for use in challenging, hard-to-reach places. Highly accurate and reliable, even in challenging applications with high ambient temperatures and dust. Examples of applications include moisture measurement in paper mills, laundry drying, IR drying processes
AutoSmart 1X
The AutoSmart 1X is an IRt/c.1X sensor connected to the AutoSmart transmitter for analog output. The IRt/c.1X is very similar to the IRt/c, and equals its reliability and robustness. With a threaded housing for easy mounting and installation, this model is used in many fields, including robotics, (3D) printing, drying and curing processes.
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